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Application Notes

Showing 1 - 19 of 19 Application Notes
产品描述
AN-2101: Mounting Recommendations for 1SP0335, 1SP0340 and 1SP0635 Gate Driver Families
Description

This application note provides basic guidelines on how to install the 1SP0335, 1SP0340 and 1SP0635 gate driver families on the IGBT modules. These recommendations are helpful to ensure proper mounting of the gate driver to the target IGBT module. It should be noted that it is recommended to use the exact target IGBT module. If issues arise due to use of different IGBT package, information in this note can help.

AN-91 - BridgeSwitch PCB Configuration for 3-Phase Inverters
Description

This application note compares the thermal performance of the triangular PCB configuration to the slotted linear PCB configuration with regards to case temperature rise above ambient temperature and temperature variations between adjacent BridgeSwitch devices.

AN-87 - BridgeSwitch in Single Phase BLDC Motor Drive
Description

This application note describes the motor control theory and inverter drive implementation for a single-phase (BLDC) motor drive using BridgeSwitch.

AN-83 - BridgeSwitch Design Tips, Techniques and Troubleshooting Guide
Description

This application note provides answers to common BridgeSwitch technical questions.

AN-80 - BridgeSwitch故障状态通信接口
Description

下载代码库:Bridgeswitch故障状态通信接口代码库

AN-79 - Wave Soldering Guidelines for InSOP and HSOP Packages
Description

This document offers guidelines for wave soldering design of InSOP-24 and HSOP-28 packages, particularly those without bottom exposed pads. Although IR/convection reflow is recommended for surface-mount attachment, both packages have been designed with wave soldering in mind when it is unavailable or not preferred. The document provides recommendations for solder pad layout, maximum spacing between solder pads, and solder thieves' orientation and design.

AN-1601: Controlling SiC MOSFET Power Switches with SCALE-2 and SCALE-2+ Gate Drivers Cores and SCALE-iDriver Gate Driver ICs
Description

This application note discusses procedures to optimize use SCALE gate drivers with SiC MOSFET switches.

AN-70 - LinkSwitch-TN2 设计指南
Description
AN-303 - Qspeed Family RoHS Compliant Soldering Considerations
Description

Qspeed Family RoHS Compliant Soldering Considerations

AN-302 - Qspeed Reverse Voltage Sharing of Series Rectifiers
Description

Reverse Voltage Sharing of Series Rectifiers

AN-301 - Qspeed Reverse Recovery Charge, Current and Time
Description

Reverse Recovery Charge, Current and Time

AN-300 - Qspeed High Temperature Reverse Bias (HTRB) Reliability Testing
Description

Qspeed High Temperature Reverse Bias (HTRB) Reliability Testing

AN-1301: 使用SCALE-2门极驱动器的注意事项
Description

该应用指南着重介绍在使用SCALE™-2驱动核和即插即用驱动器时必须考虑的重要事项。该指南是对应用指南AN-1101/1/的补充。

AN-0902 CONCEPT IGBT门极驱动器的防静电(ESD)要求
Description

对电子器件的任何处理都应遵循IEC 60747-1标准中所述的静电敏感器件的防护程序。CONCEPT门极驱动模块必须采取相应的方式处理。
本应用指南描述处理和装配所有门极驱动器件过程中对CONCEPT产品的最低防静电要求。与MOSFET或IGBT模块相似,CONCEPT产品对静电(ESD)很敏感。

AN-1101 Application with SCALE-2 Gate Driver Cores
Description

该应用指南通过详细的示例说明了如何成功地为工业和牵引应用设计IGBT驱动器,着重介绍重要的设计规则并帮助您加快开发速度。涉及到的SCALE-2驱动核包括:2SC0108T、2SC0435T、2SC0650P和1SC2060P。

AN-1001 IGBT以及MOSFET的驱动参数的计算方法 (CN)
Description

所需的门极驱动参数的计算方法。从该应用指南中得出的数值可作为选择最适合驱动器的依据。

AN-0904 SCALE-2 门极驱动核的直接并联 (CN)
Description

传统的IGBT并联方法是由单个驱动器驱动多个IGBT,每个IGBT都有独立的门极和发射极电阻。另一种并联IGBT模块的驱动方法是,每个模块都使用独立的驱动器。

AN-0901 使用SCALE-2 IGBT驱动器控制多电平变换器拓扑的方法 (CN)
Description

该应用指南描述SCALE-2 IGBT驱动器控制多电平变换器在发生故障时的处理方法。多电平变换器使用串联IGBT,进而升高变换器输出电压的幅值和谐波频率。

AN-0801 Mechanical Handling of CONCEPT Drivers
Description

该应用指南描述装配CONCEPT驱动器的正确处理方式。需要特别指出的是,不应向变压器施加过大的机械应力。