Webinar: SCALE-iFlex™ XLT – Outstanding Compactness & Integrated Thermal Measurement
Compactness and Thermal Intelligence, on a Single Board
Gate driver boards that overhang the power module force compromises everywhere else in the converter: stack spacing, busbar routing, cooling, enclosure volume.
The SCALE-iFlex XLT family removes that constraint. Each dual-channel, plug-and-play driver board fits neatly within the outline of LV100 (Mitsubishi), XHP™ 2 (Infineon), HPnC (Fuji), and equivalent “new dual” style IGBT modules, with support for high-voltage modules up to 2300 V.
It also adds integrated NTC readout, so that you’re no longer guessing at junction temperature margin. You’re measuring it and converting that headroom into output.
In this webinar, Arun Gunasekaran (Manager, System Engineering, Power Integrations) will walk through the full feature set, the design trade-offs it eliminates, and where the potential 30% power increase actually comes from.
📅 Date: 8 September 2026
🕞 Time: 02:00 PM IST
About the Speaker
Arun Gunasekaran
Manager, System Engineering
Power Integrations
Mr. Gunasekaran is an expert in analyzing specific applications and customizing optimal gate driver solutions. He has a bachelor’s degree in electrical and electronics engineering from Anna University and more than 15 years of experience in power electronics systems, from design to prototyping.
