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Future Tech Day 2025 - Guangzhou

Future Tech Day 2025 - Guangzhou
2025 July 17, 10:00 - 16:30 (Asia/Shanghai)

海航威斯汀 5楼多功能厅1+2
林和中路 6 号
Tianhe Qu
Guangzhou Shi
Guangdong Sheng, 510610
China


Join Power Integrations and other industry leaders for the latest installment of Future Tech Days in Guangzhou, where will discuss the newest developments in semiconductor technology.

Technical Session:

More Power, simplified design, and higher voltage solutions for offline power conversion

  • 13:00 - 14:00

High Voltage GaN is enabling higher power flyback conversion up to 400 W, advanced resonant converter solutions of up to 1.6 kW, and revealing the increased power capability of motor drives.

The TinySwitch-5 flyback product family power range delivers up to 175 W while aggressively targeting cost-sensitive consumer and industrial applications including those requiring the ErP-mandated 300 mW standby power rule. We are excited to offer our Future Electronics colleagues an early look at the soon to be released TOPSwitch-GaN product family. This is the first generation of TOPSwitch that uses PowiGaN technology and extends the range of easy-to-design flyback to 400 W.

PI will describe the unique opportunities available with our wide-bandgap technology for high voltage industrial, renewable, and EV applications with volume production of 750, 900, 1250, and now 1700 V PowiGaN featured in the InnoMux-2 product family of switchers that increase efficiency and reduce the component count for multi-output power supplies.

Finally, BridgeSwitch-2 power range has been extended up to 1 hp / 746 W for motor drives and the latest HiperLCS-2 LLC family offerings deliver up to 1650 W continuous for industrial, tools, and charging applications.

Presenter:

  • Qinxin Liu 刘庆新, Senior FAE
  • Jack Chen 陈东升, Product Manager

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