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1250 V / 1700 V PowiGaN for 800 VDC AI Data Center Architecture

The demands of AI computing are driving data center power architectures toward higher efficiency and power density. The capabilities of 1250 V and 1700 V PowiGaN gallium-nitride (GaN) technology for next-generation power architectures are explained in this new white paper from Power Integrations (PI).

Article - Future Electronics - How MinE-CAP Shrinks Bulk Capacitor Size

Everyone likes smaller AC-DC adapters, and GaN technology has hastened the production of high-density converters. Despite this progress, the bulk capacitor remains challenging to shrink. Power Integrations has a solution with its MinE-CAP ICs, which dynamically adjust bulk input capacitance based on input voltage. This results in a substantial reduction of occupied volume, making it easier for designers to meet high power density requirements.

Article - How to Design Small USB-C PD and PPS Adapters

The pressure on the designer is relentless - develop ever-smaller chargers and adapters that deliver full USB-C Power Delivery (PD), Programmable Power Supply (PPS) functionality, and faster charging times for smartphones, tablets, notebooks and other portable devices. Keys to designing smaller chargers and adapters include reducing component count and maximizing

Article - Tamper-proof Isolated Flyback Power Supply for Electricity Metering

This article briefly reviews the physics behind magnetizing interference in flyback power supplies and presents an anti-magnetizing interference dual-output isolated flyback power supply design. It closes with a discussion of testing and a performance comparison between an anti-magnetizing interference power supply and a conventional design.

Communication and Isolation Technology for Integrated Gate Driver ICs

New power semiconductors for high density applications require gate driver technologies that support higher working voltages and are reliable across an extended temperature range. The package must also meet international standards for creepage and clearance. This paper presents an innovative communication and isolation technology, integrated in a new industrial package

Maintaining SiC MOSFET Efficiency and Protection without Compromise

The efficiency and size benefits of SiC devices have been enthusiastically embraced by designers of industrial, automotive, traction systems and photovoltaic power conversion. To provide more detail, the lower sheet resistance of wide-bandgap SiC materials (typically 1/100th that of conventional silicon) results in smaller devices for a given current capacity—valuable

Meeting Standby Energy Requirements in Motor Drive Applications

During PCIM Europe 2025 in Nuremberg, Juan Paolo Quismundo gave a oral presentation on how to maximize available power to display, controls and communications functions for appliances needing to comply with increasingly stringent standby energy regulations. Our BridgeSwitch motor driver ICs, combined with the MotorXpert software suite, allow sleep-mode power

Optimizing Efficiency and Output Regulation for Dual-Output Flyback Converters with 1700 V GaN Switch

During PCIM Europe 2025 in Nuremberg, Han Cui gave a poster presentation about replacing SiC switches with 1700 V GaN devices in high-input voltage industrial applications. The world's first 1700 V GaN switch is now available in a new member of the InnoMux-2 flyback switcher IC family. In less than two years, Power Integrations has delivered three voltage-rating breakthroughs with its #PowiGaN technology, from 900 V to 1250 V, and now 1700 V.

Single-phase BLDC Motors for External Fan Applications

During PCIM Europe 2025 in Nuremberg, John Emmanuel Tan gave a poster presentation introducing a single-phase BLDC motor design for external fan applications. Our BridgeSwitch motor driver ICs, combined with the MotorXpert software suite, support a power range of 30 W to 746 W (1 HP) and deliver inverter efficiency up to 99%.