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Application Notes

Showing 1 - 13 of 13 Application Notes
Description
AN-98 - LinkSwitch-TNZ Family Buck and Buck-Boost Design Guide
Description

This application note provides information for designing a non-isolated power supply using the LinkSwitch-TNZ family of devices. This document describes the design procedure for buck and buck-boost converters.

AN-79 - Wave Soldering Guidelines for InSOP and HSOP Packages
Description

This document offers guidelines for wave soldering design of InSOP-24 and HSOP-28 packages, particularly those without bottom exposed pads. Although IR/convection reflow is recommended for surface-mount attachment, both packages have been designed with wave soldering in mind when it is unavailable or not preferred. The document provides recommendations for solder pad layout, maximum spacing between solder pads, and solder thieves' orientation and design.

AN-75 - LYTSwitch-6 Family Design Guide
Description

LYTSwitch-6 Family Design Guide

AN-70 - LinkSwitch-TN2 Design Guide
Description

This document describes the design procedure for buck and buck-boost converters using the LinkSwitch-TN2 family of integrated off-line switchers.

AN-65 - LYTSwitch-5 Design Guide
Description
AN-60 - LYTSwitch-0 Design Guide
Description

LYTSwitch-0 Design Guide

AN-59 - LYTSwitch-4 Design Guide
Description
AN-303 - Qspeed Family RoHS Compliant Soldering Considerations
Description

Qspeed Family RoHS Compliant Soldering Considerations

AN-302 - Qspeed Reverse Voltage Sharing of Series Rectifiers
Description

Reverse Voltage Sharing of Series Rectifiers

AN-301 - Qspeed Reverse Recovery Charge, Current and Time
Description

Reverse Recovery Charge, Current and Time

AN-300 - Qspeed High Temperature Reverse Bias (HTRB) Reliability Testing
Description

Qspeed High Temperature Reverse Bias (HTRB) Reliability Testing

AN-55 - HiperLCS Family Design Guide
Description

HiperLCS Family Design Guide

AN-39 - LinkSwitch-LP Design Guide
Description LinkSwitch-LP Design Guide