Big-Bit 2026 Digital Power Supply Key Components Summit (Shenzhen)
深圳登喜路国际大酒店，二楼国际宴会厅
宝田一路12号
Bao'an Qu
Shenzhen Shi
Guangdong Sheng, 518102
China
The 8th China Digital Power Components Application Innovation Summit (South China) will be held in Shenzhen, hosted by Big-Bit. Power Integrations (PI) technical expert will participate in the AI Server Power and Computing Efficiency Technology Innovation Forum (Breakout Session III), delivering a featured presentation on how 1250V and 1700V PowiGaN devices meet the specific requirements of NVIDIA’s 800VDC AI data center architecture.
Featured Session
AI Server Power and Computing Efficiency Technology Innovation Forum
Preferred Solution for 800V DC AI Data Centers:
1250V & 1700V GaN HEMT Power Devices
- Time: 11:35 AM – 12:00 PM
- Speaker: Shengming Jiang, Senior FAE, Power Integrations
As artificial intelligence drives urgent demand for higher power density, high-voltage gallium nitride (GaN) technology is emerging as the future of power conversion. The 1250V PowiGaN solution simplifies complex multi-stage topologies into a single-stage half-bridge LLC design, outperforming 1200V silicon carbide (SiC) MOSFETs in efficiency, thermal performance, and figure of merit (FOM). This enables a cost-effective, high power-density power solution for next-generation AI computing infrastructure.
