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Unboxing: 15 W Low-Profile Reference Design for 800V AI Data Centers
See how Power Integrations' low profile reference design, DER-1114, enables efficient auxiliary power conversion in 800 VDC AI data centers.
HiperLCS-2 Chipset Introduction
The new HiperLCS-2 chipset (HiperLCS2-HB power device + HiperLCS2-SR isolation device) brings Power Integrations’ unique 600 V FREDFETs and magneto-inductive FluxLink technology to the LLC topology. The result is 98% efficiency and 40% component-count reduction in LLC resonant power converters up to 250 W.
Vice President of Marketing Doug Bailey explains.
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