Top264EG heat sink

Posted by: mamech on 02/08/2016

hello

I am designing DC/Dc converter using PI tool. the tool selected automatically the TOP264EG Ic (the software showed it to me in the BOM), and the software wrote this note in the end of BOM : "52 mm² area on Copper PCB. 2 oz (70 µm) thickness. Heatsink for use with Device U1."

when I investigated the datasheet of this Ic, and I found that the TOP264, an I found that TOP264EG comes in

SIP7 package, which means that it used external heatsink, not pcb copper area heat sink.

my question is: Does TOP264EG really needs a copper area? or it needs an external heatsink??

thanks

Comments

If you are using E-Package , it need Heat sink based on your power and the thermal rise of the Part. However, if you use V-Package part, you can use the PCB Copper area heat sink for the TopSwitch V Package Part.In the below application note, if you go to Page 4 , there is a section called Select heat sink type and enclosure, please go through it :

https://ac-dc.power.com/sites/default/files/product-docs/an47.pdf

I want to use E package, but I seached so much over internet to find any standrad heatsink for the e-sip 7 package. can you tell me any supplier that provide the heatsinks for top264 e-package??

Hello mamech,

we provide samples, you can check if this is good for you or not. if you need large amount, please contact the sales in you ditribute region.

http://store.power.com/samples-store/esip-clip-samples/