Feasibility of using INN3678C-H606 (Reference design DER-909) for Medical power supply applications
Posted by: pratik_n
on
Hello PI team,
I have been working on Class II medical power supply application using INN3678C-H606 IC. Creepage and clearance constraints are strict for medical applications (IEC60601-1 standards)
My question is whether INN3678C-H606 IC is suitable for Class II medical power supply applications. Because on the secondary side, the pin to pin pitch for the PI controller is 0.75mm or 30mils.
So, please confirm if the INN3678C-H606 IC is designed to meet medical applications Class I and/or Class II requirements as per (IEC60601-1 standards)?
Regards,
pratik_n
댓글
Hi PI Expert,
Thank you for the clarification.
Regards,
pratik_n

Hi pratik_n,
Good day. Thank you for your interest in using Power Integrations solutions.
The IEC 60601-1 medical standard distinguishes between two categories of protection:
The device has been certified with a Reinforced insulation and maintains a minimum creepage distance of 10.8 mm between input and output pins, aligning with the double insulation requirements for MOOP of IEC 60601-1. This is because the double insulation requirements for MOOP are same as the Reinforced insulation of IEC 62368 and IEC 60950 standard, under which the device was certified.
If this Reinforced spacing of 10.8 mm. can satisfy the customer requirement for their Class I or Class II power supply under MOOP category, then device is suitable for MOOP application.
However, for applications requiring MOPP, the requirements are more stringent, requiring higher creepage distances and isolation voltage. The device may not meet these requirements for MOPP applications.
Regarding the pin-to-pin pitch on the secondary side of the IC, the creepage and clearances for functional insulation is not considered or mandated to meet for our IC component level certification. Functional insulation pertains to insulation necessary only for the correct operation of the equipment, not for providing protection against electric shock. Alternative method for this is to perform fault testing and that should be done at the end-system level to ensure overall safety compliance.
Thank you for your understanding.