Heat spreader used in Innoswitch design (DER601)
Hi,
Thanks for showing the heat spreader in the DER-601 report of the 65W PSU.
By how many degrees roughly do you think this reduces component temperatures? I di notice that the heat spreader isnt connected in any way to the source of the Innoswitch, or its thermal; copper pour.
Also, since its mainly really the electrolytic capacitors which need the temperature reduction, would you think it might be preferable to have a enclosure design where the electrolytics are in separate compartments to the rest of the power components?
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Thanks, please advise on how the heat spreader metal is connected to the thermal pads? Do you mean the heat spreader simply has a thermal pad on it and the other side of it rests on the thermal copper pour of the Innoswitch? I was wondering if the heat spreader is forcibly afixed to the thermal pad pf the innoswitch by pressure from screws/fasteners? If the heat spreader is just resting on the thermal pad, then its not so well connected, as you know, pressure is needed to forcibly hold a heatsink to a device.
Please explain how the heat spreader is forcibly connected to the thermal copper pour of the innoswitch?
Hello treez,
there is pressure there between the thermal pad, heat spreader and components. the thermal pad is soft and have some thickness. together with the case, heat spreader and thermal pad selection and design, you could have proper pressure to help the spread the heat from the components.
Best Regards
Hello Treez,
Thank you for the interested in using Power Integrations products.
The heat spreader here are using to absorb the heat of all hot components and make those components low temperature. The heat spreader is connected to the hot components through the thermal pads.
You idea is also great. If you could share some more details with us about how you plan to achieve it. we can give our comments and recommendations if possible.
Best Regards