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Heat sink calculations for TOP269E and irfbc40 mosfet as a stackfet configuration

Posted by: mohan.n2293@gm… on

Hi Pi,
Im designing a power supply for 3-phase input,spec is
vin_min=180
vin_max=440
vout=65W

Please provide guidelines or application notes or links to find out heat sinks for both TOPSWITCH and MOSFET.
Please respond as early as possible.

コメント

Submitted by mohan.n2293@gm… on 10/10/2017

Thanks for the reply,

But when it comes to flyback converter their will a conduction loss and switching loss so how should i differentiate that.

Please guide me with suitable reference document.

Submitted by PI-DATA on 10/11/2017

Hi Mohan,
In flyback converter, you would just sum up the conduction loss and switching loss for total heat dissipation. Usually temperature depends on the ambient temp, size of the board, etc. I suggest to use thermal simulation to find the optimum heat sink size and shape since this is in Mechanical engineering discipline.

Regards.

Submitted by mohan.n2293@gm… on 10/16/2017

can you please guide me how thermal simulation can be done .

Submitted by PI-DATA on 10/17/2017

Hi Mohan,
First is to measure actual power loss by subtracting output power from input power.
Then one by one, measure every components power loss. then enter this data on your thermal software simulator.

Regards.

Submitted by mohan.n2293@gm… on 11/24/2017

Please suggest me any thermal solution related software

Submitted by PI-DATA on 11/24/2017

FloTherm is a good thermal simulation tool.