LNK6774 in eSOP-12 SMD (eDIP-12 -pins just bended otherwise)
Hi!
we want to use an LinkSwitch like LNK6774V, but in SMD placement.
The eSOP-12 is an SMD package (we use it at the TOP264KG), where the pins just bended in other way.
Advantages:
SMD (instead THT), lower placement costs
exposed pad is a solderable pad to the pcb (instead top for external heat sink)
no holes destroy the multilayer-layout
Is it planned to build the LNK6774 (or almost same out of this family) in eSOP-12?
Best regards...
Comments
Hi Traveler,
thanx for answer.
We wount bend the pins manually by ourselves (from THT to SMD).
The TOP264KG in package eSOP-12 looks like the same pad as eDIP-12, also the pins are almost the same. They are a bit longer and bended for THT mounting. The TOP264KG-datasheet about the eSOP-12:
"Heat transfer to PCB via exposed pad aund SOURCE pins, Supports wave or reflow soldering"
I think production of this two packages are almost the same, only the pin-cut and bending is different.
As you aren't in the product planning group, could you please give me the contact to the correct group?
Best regards...
Chicken -
I can't put you in contact with the product planning group. Even if I could, they're not going to comment about possible future products.
Regards,
The Traveler
many thanks!
I will try to place a suggestion, if I find the correct contact-point.
See you...
Chicken -
Here is the email adress for the US Sales Office. This would probably be the best place to send in a product/feature suggestion.
Regards,
The Traveler
Hi Traveler,
I couldn't see an email adress.
So I mailed today to usasales@powerint.com, BCC: eurosales@powerint.com
Best regards,
chicken
no reaction for 6 weeks...
Are the sales-mails the wrong contact? So I have to contact distribution...?
We currently do not have SMD package for LNK-HP. We plan to have this in near future -- date has not been determined.
one year is gone...
Thanks for your input. We will consider your comments in future plans. Please keep following up with our latest development through our website.
Most of our product lines have SMD options available. As this is a relatively new product of ours, it's possible we have a SMD package in the works. However, I'm not part of the product planning group so I can't comment with any certainty on that subject.
As far as your modifcations to the IC, I wouldn't reccomend this in a production environment. Bending the IC pins could stress the IC package causing reliability and/or tolerancing problems. Also, the back of the IC package is source connected but it's not intended to be soldered to the PCB. It's source connected only to minimize EMI issues.
Regards,
The Traveler